| 摘要 |
PURPOSE:To increase the reliability on junction by forming solder bump in advance on the electrode on a circuit board, and positioning a gold bump on a semiconductor IC chip and heating and alloying them, and then, supplying charge resin between the semiconductor chip and the circuit board, and heating and hardening them. CONSTITUTION:An Al electrode 2 is formed on an IC chip 1, and then an Au bump 3 is formed. Next, an electrode 5 is patterned on the circuit board 4 consisting of alumina, and then a solder bump 8 is formed. Next, the IC chip 1 is positioned to the circuit board 4, and the Au bump 3 is junctioned with the solder bump 8. Next, with a binder as a principal agent, epoxy resin is made into charge resin 9 by adding aluminum nitride powder as an additive, butadiene as a flexibilizer, and bismuth ion supplementary agent as a supplementary agent, using phenol novolak resin as a hardener, and it is charged between the IC chip 1 and the circuit board 4, and then it is debubbled and heated and hardened. |
