HEAT TREATMENT FOR SILICON WAFER,申请号JP19930077946-传众专利搜索

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法人/股东/高管

发明名称	HEAT TREATMENT FOR SILICON WAFER
摘要
申请公布号	JPH06291124(A)	申请公布日期	1994.10.18
申请号	JP19930077946	申请日期	1993.04.05
申请人	KAWASAKI STEEL CORP	发明人	HAYASHI TERUYUKI
分类号	H01L21/322;H01L21/324;(IPC1-7):H01L21/322	主分类号	H01L21/322
代理机构		代理人
主权项
地址

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