METHOD FOR BENDING OUTER LEAD AND SEMICONDUCTOR DEVICE USING THE LEAD,申请号JP19930066644-传众专利搜索

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发明名称	METHOD FOR BENDING OUTER LEAD AND SEMICONDUCTOR DEVICE USING THE LEAD
摘要
申请公布号	JPH06283642(A)	申请公布日期	1994.10.07
申请号	JP19930066644	申请日期	1993.03.25
申请人	APIC YAMADA KK	发明人	FUJIWARA KAZUO
分类号	H01L23/50;H05K1/18;H05K3/34;(IPC1-7):H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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