Photosensitive resin composition for forming polyimide film pattern comprising an o-quinone diazide photosensitive agent

摘要

Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: <IMAGE> where, R1 represents a tetravalent organic group, R2 represents a divalent organic group, and R3 and R4 represent a monovalent organic group, at least one of R3 and R4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.