Verfahren and Apparat zum Verbinden elektrischer Bauelemente mittels Lötelementen.

摘要

The components (20, 24) are provided with electrical contact pads and, given two components to be interconnected, the pads of one of them are covered with solder elements (28), made of a metallic material with low melting point, which can be soldered to the pads, the latter being wetted by the material in the molten state whilst their surroundings are not. The components are placed in contact in such a way that these elements cover the corresponding pads of the other component and the assembly obtained is brought to a temperature enabling the material to melt. …Application to microelectronics. ……