| 摘要 |
The semiconductor package structure includes a semiconductor chip 11, an adhesive lead 12 having a mounting portion 12a on which the semiconductor chip 11 is mounted, an inner lead 12b connected to the semiconductor chip 11 and an outer lead 12c for packaging a substrate, a metal wire 13 connecting a bond pad 11a of the semiconductor chip 11 to the inner lead 12b of the adhesive lead 12, epoxy molding compound 14 protecting the semiconductor chip 11, an adhesives which bonds the semiconductor chip 11 to the mounting portion of the adhesive lead 12, thereby to solder the semiconductor chip on the PCB directly.
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