| 摘要 |
PURPOSE:To obtain a roughening technique which roughens the bonding face of a printed circuit copper foil producing no powder to enhance the copper foil in adhesive strength to a resin board without inducing an environmental problem. CONSTITUTION:A roughening-treated layer 3 formed of a large number of protrudent copper deposits which contain chrome and/or nickel is provided to the bonding face of a copper foil 1, and it is preferable that a copper plating layer 4 covering the roughening-treated layer 3, a treated layer 5 formed of one or more elements out of copper, chrome, nickel, iron, cobalt, and zinc or allay of them, and a rust preventive layer 6 which covers the treated layer 5 are provided for the formation of a printed circuit copper foil. An acid copper electrolytic bath is made to contain one or two kinds of ions out of iron, nickel, and cobalt ion 0.001 to 5g per l in concentration. Rounded electro-deposited copper is formed restraining dendrite from growing, so that a printed circuit copper foil of this design can be enhanced in adhesive strength producing no powder and prevented from deteriorating in electrical properties after etching. |
