| 摘要 |
PURPOSE: To enable efficient thermal dissipation by encapsulation, based on conductivity by expanding a chip in the directions of the three side faces of the chips and mutually stacking the chips, so as to connect to a thermal dissipation means on a fourth side face. CONSTITUTION: A connecting means expands a pad 15 of each chip 1. The connecting means is provided with an insulated film 2 and a conductive track 31 on this film 2, and this track 31 is connected with the pad 15 by conductors 16 to 18, towards at most the three side faces 12 to 14 of the chip. Next, the chips 1 are deposited and these chips 1, and the conductors 16 to 18 are fixedly combined in an electrically insulated material. Thereby, the conductors 16 to 18 are made to exist on the same flat face as the faces 71 and 73 of a deposit 70, except at least a fourth face on a fourth side face 11 of the chip 1. Next, an electrical connection is formed between the conductors 16 and 18 on the faces 71 and 73 of the deposit 70. Then the chips 1 are mutually deposited and connected to the thermal dissipation means by the fourth side face 11. |
