MANUFACTURE OF MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To reduce the nonuniformity of the thickness of a photosensitive organic high polymer film to be used as a layer insulating film for a multilayer interconnection board which uses organic high polymer material as a layer insulating film. CONSTITUTION:Photosensitive polyimide is applied on a basic polyimide film 2 on an alumina board 1 so as to form a layer insulating film 3 and a groove 4 for forming metal wiring is formed on the layer insulating film 3 along an area whereupon first layer wiring is to be provided. Copper plating wiring 5 is provided in the groove 4 by electroless plating and electrolytic plating and the surface of the copper plating wiring 5 and the surface of the layer insulating film 3 are formed almost flatly. When photosensitive polyimide is applied and top layer insulating films 6 and 8 are formed, the surfaces of the layer insulating films 6 and 8 can be formed flatly and the nonuniformity of the film thickness is reduced.