Interlayer connections (3) for internal signal paths of the printed circuit board (1) are combined in groups and preferably situated in the shielding zone of shielded connectors for shielding cable to be plugged in. This arrangement insulates the interlayer connections (3) against high frequencies.
申请公布号
DE4236593(A1)
申请公布日期
1994.05.05
申请号
DE19924236593
申请日期
1992.10.29
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
HEITZIG, CLAUS-PETER, 8063 PFAFFENHOFEN, DE;THALHAMMER, ERICH, 8000 MUENCHEN, DE
