| 摘要 |
PURPOSE:To reduce consumed power, and allow the temperature control of a wafer by controlling a constant voltage source for heating the wafer for fusing and cutting a flexible tube on the basis of the detected temperature of the wafer. CONSTITUTION:A wafer heating control means 44 has a deviation signal output part 57 for outputting a deviation signal (d) between a corrected temperature (b) calculated by the PID corrector 56 of a corrected wafer temperature calculating part 51 on the basis of the output (a) of a temperature detecting means 7 and a target heating temperature (c) of a wafer, and outputs a corrected deviation signal (e) by a PID corrector 58. Pulse width modulation signal output parts 59, 60 output a pulse width modulation signal (f) on the basis of the corrected deviation signal (e). Further, the wafer heating control means 44 has a drive circuit 62 for controlling a constant voltage source 43 by the pulse width modulation signal (f) and a pulse width modulation signal control part 61 for controlling the inflow of the pulse width modulation signal (f) from the pulse width modulation signal output part 59 to the drive circuit 62 on the basis of the detection signal (h) of the wafer short-circuit detecting parts 67, 58 of a wafer short-circuit protecting circuit 65. |
