| 摘要 |
PURPOSE:To obtain a method by which soldering can be easily performed in a through hole for connecting multilayered printed circuits to each other and a highly reliable multilayered printed wiring board can be obtained. CONSTITUTION:The outside diameter of the connection land of the innermost printed wiring board of inner- and outer-layer printed wiring boards 30, 40, and 50 is made larger than the diameter of the through hole of the connection land of the outermost printed wiring board and, at the same time, the diameters of through holes 16, 17, and 18 are made larger on the boards 40 and 50 sides against the board 30 side. In addition, a laminated printed wiring board 60 is formed by piling up the boards 30, 40, and 50 and fixing the boards 30, 40, and 50 to each other with a plurality of screws 20. After installing a plurality of thin wires 21 in the holes 16, 17, and 18 of the board 60, the holes 16, 17, and 18 are filled up with solder 22 by utilizing the capillary actions of the wires 21 and the boards 30, 40, and 50 are electrically connected to each other. Thus the title board is manufactured. |
