发明名称 BONDING METHOD
摘要 PURPOSE: To align the ink orifice of a nozzle member with a heating element on a substrate by positioning the heating element and the substrate arranged with electrodes with respect to the nozzle member such that the heating element is aligned with the orifice or bonding the lead to the substrate electrode by means of a bonding tool. CONSTITUTION: A print head has windows 22, 24 for exposing the trace end part to a polymer tape having an orifice 17 and a conductive trace and n automatic inner lead bonder aligns the orifice 17 of a nozzle member 16 automatically with a heating element on a substrate. Since the orifice 17 has already been aligned with the conductive trace on the nozzle member 16 and the substrate electrode has been aligned with the heating element, the orifice 17 and the heating element are essentially aligned with the electrode on the substrate and the exposed end of the trace. Subsequently, the inner lead bonder bonds the trace to an associated substrate electrode while passing the trace through the windows 22, 24 of a tape 18 using the gang bonding.
申请公布号 JPH0623997(A) 申请公布日期 1994.02.01
申请号 JP19930098566 申请日期 1993.04.01
申请人 HEWLETT PACKARD CO <HP> 发明人 UINSUROTSUPU DEE CHIRUDAAZU
分类号 B41J2/05;B41J2/16;H05K3/32;(IPC1-7):B41J2/16 主分类号 B41J2/05
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