发明名称 EXPOSING METHOD FOR THICK FILM WIRING PATTERN
摘要 <p>PURPOSE:To improve the sectional shape of parts where a positive type photosensitive material is removed from a reverse taper shape to a positive taper shape even if exposing is not executed dividedly plural times by providing a photomask with a transmittance distribution. CONSTITUTION:Wiring patterns of 100% transmittance are provided within the parts where the transmittance of light is 0 percent. The orientation 4 of liquid crystals is changed by changing the voltages to be impressed to the respective liquid crystal cells 3 of a projection type liquid crystal display 1 by a voltage controller 2 in such a manner that the transmittance increases gradually from the periphery to the inside of the wiring patterns near the boundaries of the wiring patterns. The parts where the light does not fall are the cured parts and the parts where the light falls are the uncured parts if the positive type photosensitive material is exposed by using the projection type liquid crystal display 1 controlled in such a manner as a photomask. The wiring patterns having the sectional shape which is nearly the positive taper shape are formed if these parts are removed by a method, such as wet etching.</p>
申请公布号 JPH063827(A) 申请公布日期 1994.01.14
申请号 JP19920158413 申请日期 1992.06.18
申请人 NEC CORP 发明人 KONDOU SHIYOUICHI
分类号 G03F1/00;G03F1/68;G03F7/20;H05K3/00;H05K3/10;(IPC1-7):G03F7/20;G03F1/08 主分类号 G03F1/00
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