| 摘要 |
PURPOSE:To prevent the generation of flash, in the seal molding of an electronic part by a thermosetting insulating resin, by preventing the penertation of a sealing resin into the gap between a mold and the non-sealing part of the part. CONSTITUTION:Beat-resistant resin films 9 each slightly larger than the area of the main surface of the connection terminal 7 of a small-sized transformer 8 are bonded to the upper and rear main surfaces of the connection terminal 7 and the whole is arranged in a mold at a predetermined position and the connection terminal 7 having the films 9 bonded thereto is carefully arranged in the cavity part of the mold. Next, a liquid thermosetting insulating resin is received in the mold to be cured. After curing, the small-sized transformer 8 subjected to seal-molding is taken out of the mold and the resin films 9 are peeled to expose the connection terminal 7. |
