发明名称 PACKAGE FOR OPTICAL TRANSMISSION-RECEPTION MODULE
摘要 PURPOSE:To obtain a package for optical transmission-reception modules which can be automatically mounted and the circuit board of which can be miniaturized by fixing lead parts and connecting parts to the circuit board in a face- contact state. CONSTITUTION:Lead parts 4a and connecting parts 4b are formed into flat shape so that the parts 4a and 4b can be brought into face-contact with a circuit board 1 and, while the parts 4a are terminals for electrical connection, the parts 4a are subject to soldering and have certain degrees of mechanical strengths. The parts 4b having a larger contact area than the parts 4a have and provided on a connector 3 side of the parts 4a are mechanically strongly connected to the board 1 by soldering, but the parts 4b are provided at a location where stresses tend to concentrate when the connector 3 is inserted and removed. Therefore, the parts 4a and 4b can be automatically mounted on this module, because they are surface-mounted similarly to ordinary electronic parts and the module has a sufficiently high reliability against the mechanical stress applied to the mounting surface when the connector 3 is inserted and removed. In addition, the circuit board 1 can be miniaturized, since the number of required through holes can be reduced.
申请公布号 JPH05335603(A) 申请公布日期 1993.12.17
申请号 JP19920134683 申请日期 1992.05.27
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TAKIMOTO HIDEYUKI;TAKAHASHI HISATO;KAMAKURA MITSUTOSHI
分类号 H01L31/0232;H01L33/00;H05K3/34;(IPC1-7):H01L31/023 主分类号 H01L31/0232
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