| 摘要 |
<p>PURPOSE:To simplify management of reflow processes for solder bumps by means of a ceramic multilayer board on which semiconductor elements that can be used for every electronic equipment such as a computer, a video and a TV, or the like, are mounted in the manner of a flip-chip, and to obtain a ceramic multilayer board which enables a high density of packaging to be realized by reducing pitches between terminals. CONSTITUTION:In a ceramic multilayer board, no interconnection electrode is disposed at least at the area, where a flip-chip is to be mounted, of vias 1 on the uppermost layer and vias 2 on the lowermost layer. Only the via at this area is constituted of Al2O3-free material that solely contains Cu. The other vias are composed of a composite material containing 10-20wt.% Al2O3 with the balance being Cu.</p> |
