| 摘要 |
<p>PURPOSE:To avoid the vertical movement of a chip during the resin sealing step by a method wherein an inner lead is arranged extending over the center line of the chip for increasing the bonding area of the inner lead onto a both side adhesive tape. CONSTITUTION:The end region (whereto an Au wire 4 is connected) 1a of an inner lead 1 extending over the center line of a chip 2 and the intermediate part 1b of the inner lead 1 are bonded onto the chip 2 through the intermediary of a both side adhesive tape 3. Thus, the bonding area of the inner lead 1 onto the tape 3 is to be increased. Through these procedures, the adhesion of the chip 2 to the inner lead 1 can be augmented simultaneously spreading out longer inner lead 1 on the chip 2 so that the vertical movement of the chip 2 to the title lead frame for semiconductor device can be avoided.</p> |
