| 摘要 |
PURPOSE:To prevent the occurrence of excessive gate remainder and materialize the rationalization of transfer mold process and the maintenance of a tie bar cutting mold by forming a cross-section reduced part in the top part of a gate, and injecting resin and hardening it, and then, cutting the resin hardened at a gate part at that cross-section reduced part. CONSTITUTION:A lead frame is used, in which two tie bars 2 provided in opposite positions, a mount piece 4 provided between the supporting tie bar 2, lead terminals 6-8, and an interlead tie bar 9 for supporting the lead terminals 6-8 are made integrally. And in the condition that the semiconductor element placed on the mount piece 4 and the lead terminals 6-8 are connected, resin is injected from the gate 11 provided in the vicinity of one supporting die bar 2 so as to seal it with resin. In such a manufacture of a semiconductor device, a cross- section reduced part 11a is made in the top section of the gate 1, and after injection and hardening of the resin, the resin hardened at the section of the gate 11 is cut at the cross-section reduced part 11a. |
