| 摘要 |
<p>PURPOSE:To extend the break life of an electrode by preventing the occurance of a thermal stress and a thermal strain at the time of the solder flow, in a thin-film multilayer interconnection board wherein a semiconductor chip is connected through solder balls. CONSTITUTION:Electrodes for mounting a semiconductor ball are located symmetrically about the center of a thin-film multilayer interconnection board 3 or about the center line. These electrodes include effective electrodes (white circle 4) which are electrically connected to a semiconductor chip (requiring connection) and uneffective (dummy) electrodes (black circle 7). The effective electrodes include isolated electrodes 6 (having no effective electrode at adjacent lattice points). All these electrodes are symmetrized (about a point or about a line) and are electrically connected to a wiring on the rear face of the substrate via a through hole and therefore electrical isolation of the electrodes can be avoided.</p> |
