| 摘要 |
<p>A mold release composition which comprises 10-95 wt.% of a copolymer of a C1-C20 polyfluoroalkyl ester of acrylic or methacrylic acid with a vinylic compound having a C8-C30 alkyl group and 90-5 wt.% of a silicone. It has a sufficient ability to effect mold release, little transfers to the surface of a molding, and does not adversely affect the fabricability of the surface of a molding.</p> |
