| 摘要 |
PURPOSE:To provide a lead frame that needs no solder bumps on the electrodes of a wiring board. CONSTITUTION:A lead frame 11 has outer leads 15a with solder foil 1. This eliminates the need for solder bumps on electrodes of a wiring board. In- addition, the thickness of solder 4 can accuratelyl be controlled and sufficiently increased. |
