| 摘要 |
PURPOSE:To obtain constitution wherein a metal mold necessary for working of outer leads having one kind of shape can be used for a various kinds of resin packages, and change of a lead frame is not necessary when the shape of an outer lead is changed. CONSTITUTION:A semiconductor chip 30 is bonded and fixed on an island 31. An inner lead 32 is connected with an electrode of the semiconductor chip 30 by using a bonding wire 33. Resin sealing is performed so as to leave the tip part of the inner lead 32, thereby forming a resin package 34. The tip part of the inner lead 32, which part is not sealed, is applied to a connection lead 35 and connected with an outer lead 36 or 37 or 38 subjected to shape working, by using conductive adhesive agent. |
