发明名称 SILVER PASTE CURING DEVICE
摘要 <p>PURPOSE:To decrease the consumption of inert gas and reduce the floor space for a silver paste curing device by a method wherein curing units are stacked up vertically, and a cover is provided, surrounding the curing units. CONSTITUTION:Heaters 1 used for curing lead frames 5 are stacked up vertically. That is, a piping 3 is arranged above the heater 1 to blow inert gas of nitrogen against the lead frame 5, and the heaters 1 are surrounded in a cover 4a, including the other component parts. Furthermore, a port opening 7 through which the lead frames 5 are taken in and out is provided to the undermost part of the cover 4a, facing down. As the heaters 1 are stacked vertically, a silver paste curing device of this design requires less floor space. The cover 4a extends high in a vertical direction, so that the consumption of inert gas can be lessened as much as possible.</p>
申请公布号 JPH05235066(A) 申请公布日期 1993.09.10
申请号 JP19920031183 申请日期 1992.02.19
申请人 NEC KYUSHU LTD 发明人 FUJITA TADAHIRO
分类号 H01L21/324;H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/324
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