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发明名称
LEAD FRAME FOR RESIN SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH05226552(A)
申请公布日期
1993.09.03
申请号
JP19920030613
申请日期
1992.02.18
申请人
MITSUBISHI ELECTRIC CORP
发明人
YAMAMOTO KENJI;TONE YOSHIMORI;ONO YUKIMITSU
分类号
H01L21/56;H01L23/50
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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