| 摘要 |
PURPOSE:To prevent a sealing material from running out of a dam without increasing the thickness of the dam. CONSTITUTION:A semiconductor chip 2 is mounted on the surface of a substrate 1 and then a sealer 4 is filled in a dam 3 provided as if encircling the semiconductor chip 2 by screen printing a resin on the surface of the substrate 1 so as to manufacture the title semiconductor device sealing up the semiconductor chip 2. At this time, the dam 3 is formed of a base layer 3a printed on the surface of the substrate 1 by rough meshed screen printing plate and a surface layer 3b printed on the surface of the base layer 3a by fine meshed printing plate. Through these procedures, the base layer 3a can be formed in specific thickness by screen printing step using rough meshed screen printing plate while the surface layer 3b in small ruggedness can be formed on the surface of the base layer 3a by screen printing step using the fine meshed screen printing plate. |
