发明名称 POSITIONING MECHANISM OF SEMICONDUCTOR SUBSTRATE
摘要 <p>PURPOSE:To provide a positioning mechanism of a semiconductor substrate which is capable of high precision positioning with high reliability, said semiconductor substrate being almost free of any impurity such as abrasion power badly affecting the semiconductor substrate, and hence being highly purified. CONSTITUTION:In a support table 1 of a semiconductor substrate sticking device where a surface for supporting a semiconductor substrate is disposed at an angle respect to a horizontal surface, there are disposed on the surface of the support table a plurality of positioning pins 2, 3 at a shorter interval than the length of an orientation flat of the semiconductor substrate on a straight line having an angle with respect to the horizontal surface, and at least one second positioning pin 4 at a predetermined location of a semiconductor substrate which moves on the surface of the support table owing to gravity.</p>
申请公布号 JPH05218181(A) 申请公布日期 1993.08.27
申请号 JP19920046299 申请日期 1992.01.31
申请人 CANON INC 发明人 YANAGIDA KAZUTAKA;TAKIZAWA TORU;ISHII MITSUHIRO;YAMAGATA KENJI;FUJIYAMA YASUTOMO;YONEHARA TAKAO
分类号 H01L21/68;H01L27/00 主分类号 H01L21/68
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