发明名称 POLYPROPYLENE FILM FOR PROCESSING USE
摘要 PURPOSE:To provide polypropylene film for processing use wherein a final molded body can be molded by giving high form accuracy and strength to a primary form body when a fiber-reinforced resin molded body using epoxy resin is molded from its prepreg (molding temperature is about 130 deg.C). CONSTITUTION:A polypropylene film has a thickness of 15mum50mum, preferably 20mum-40mum, a maximum tensile strength of 18Kg/mm<2>-30Kg/mm<2> in both length and width, preferably 20Kg/mm<2>-25Kg/mm<2>, a heat shrinking percentage of 0.05%-5.0% in both length and width when it is exposed to a temperature of 120 deg.C for 15 minutes. When this is used, a prepreg is wound on a core material so as to form a primary form body, the polypropylene film for processing use is wound on the primary form body, and it is thermoset.
申请公布号 JPH05212785(A) 申请公布日期 1993.08.24
申请号 JP19920019971 申请日期 1992.02.05
申请人 SHIN ETSU CHEM CO LTD 发明人 MOTOMIYA TATSUHIKO;TSUCHIDA MICHINORI;KIMURA FUJI
分类号 B29C53/60;B29C55/12;B29C70/06;B29K23/00;B29L7/00 主分类号 B29C53/60
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