| 摘要 |
PURPOSE:To remove abrasive which deteriorates the quality of a wafer and improve dressing efficiency by applying ultrasonics on a holding pad or a polishing cloth which is left in the water or in the flowing water. CONSTITUTION:A polishing cloth 9 has a same structure as a holding pad 4 and the cloth 9 polishes the plane of a wafer 3 while holding abrasive 8 on the surface. The holding pad 4 or the polishing cloth 9 is left in the water or in the flowing water and under such condition, ultrasonics 10 are applied from the top or the bottom. Thus, abrasive 8 permeated deeply into the holding pad 4 or the polishing cloth 9 is removed. The flatness of the wafer is improved, the deterioration of the holding pad or the polishing cloth is reduced and usage frequency is increased. |
