| 摘要 |
PURPOSE:To achieve the speedup of bonding operation by taking in a picture data and then analyzing the picture data to take out micro chips one by one to shorten a period of time required for the operation of taking in the picture data. CONSTITUTION:Micro chips such as three or are pieces of LED chips 4, 4 and the like are simultaneously taken in as a picture data through a camera placed over a number of micro chips such as the LED chips 4, 4 and the like standing in a row on a transfer table such as a precision X-Y table and the like. After that, the distance between micro chips adjoining each other is derived as to two or more pieces thereof by analyzing the picture data, and the transfer table is horizontally moved in an intermittent manner based on the derived distance, and the micro chips are taken out one by one with a vertically and horizontally movable taking-out member such as an adsorbing head and the like. Thus, a plurality of chips are taken out with the operation of taking in a picture once performed, so that the speedup of bonding operation may be achieved. |
