| 摘要 |
PURPOSE:To provide such a cutting method that flatness of a wafer material is kept at a favorable value and a number of hand dressing times for an inner diameter saw blade can be reduced. CONSTITUTION:A displacement sensor 6 is provided close by the edge 5a of a blade 5 of an inner diameter saw blade type slicing machine and an output signal of the displacement sensor 6 is applied to a control device 8 through a monitor 6. When a quantity of a displacement of the edge 5a exceeds a pre- established standard value during cutting of a silicone ingot, a fine adjustment device 9 of a cutting water nozzle is operated by an instruction signal of the control device 8 and the cutting water nozzle 11 is moved slightly upward or downward. With this construction, a deviation is generated in the quantity of cutting water which has been supplied evenly to both sides of the top and bottom of the blade 5 and the displacement of the edge 5a by a thermal strains is corrected. Since advancing direction of the edge 5a is controlled like this, flatness of a wafer material becomes favorable and a number of hand dressing times which has been performed frequently so far is reduced drastically. |
