| 摘要 |
The present invention relates to a resistive-load hyperfrequency passive component (1) for power dissipation, comprising a support (2), a wiring area (3), a ground area (5) and a resistive layer (5) exhibiting a standard resistance between the wiring area (3) and the ground area (4). The invention is characterised in that it comprises fully integrated hyperfrequency adaptation capacitive and inductive elements outside the resistive layer (5) in order to achieve multiple adaptation by means of serial multiplication of the inductive elements and parallel multiplication of the capacitive elements. |
