发明名称 Bonder
摘要 A bonder that allows replacement of the bonding tool, corresponding to changes in the type of bonded component, to be performed both easily and rapidly, while also preventing the occurrence of operator-initiated errors accompanying the changes in bonded component type. As a result of allowing a bonding plate, which jointly applies compressive force to bonded components with a bonding tool, to float freely while being held by a diaphragm, the bonded components are adhered to the pressing surface of the bonding tool by the unrestricted bending of the diaphragm so as to follow its motion, thus eliminating the need for an operator to adjust the inclination of the bonding tool, as is necessary in conventional bonders.
申请公布号 US5222648(A) 申请公布日期 1993.06.29
申请号 US19920934265 申请日期 1992.08.25
申请人 KAIJO CORPORATION 发明人 TAKANO, TADASHI
分类号 H01L21/60;B23K3/08;H01L21/52 主分类号 H01L21/60
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