| 摘要 |
PURPOSE:To enable clear photographing of the outermost layer to be inspected microscopically by bonding a wire on the outermost layer of a test piece to prevent 'sagging' of the outermost layer in grinding. CONSTITUTION:A wire 4 is arranged on the surface of the outermost layer 3b on the side of a surface 3d to be inspected of a sample piece 3c put closely on the outermost layer 3b to get the both bonded integral. Then, the test piece 3c is embedded into a molding resin 5 with the surface 3d to be inspected being exposed. Then, the exposed surface is ground. The surface 3d to be inspected of the test piece 3c and a partial surface of the wire 4 are ground together. But because the wire 4 is harder than the molding resin, the outermost layer 3b will not be ground, excessively in the process of grinding thereby enabling microscopic inspection of the surface to be inspected and the outermost layer at the same focusing. |
