发明名称 LED module and manufacturing method thereof
摘要 An LED module and a manufacturing method thereof are disclosed. The LED module includes a PCB and an LED chip connected with the PCB and a light congregating cup mounted on the PCB. Two ends of the light congregating cup define two hatches, the two hatches run-through each other and form a chip containing space within the light congregating cup. The LED chip is contained in the chip containing space and packaged therein by a packaging colloid. Because the light congregating cup is assembled with the PCB, the operating time of the production machine can be lowered. The defect rate, caused by traditional methods of setting the LED chip in a slantwise concave, can also be reduced. Moreover, the invention also provides a manufacturing method for the LED module.
申请公布号 US2008230797(A1) 申请公布日期 2008.09.25
申请号 US20070723563 申请日期 2007.03.21
申请人 CHANG HUI-HUNG;CHIEN SHENG-CHE 发明人 CHANG HUI-HUNG;CHIEN SHENG-CHE
分类号 H01L33/48;H01L33/54;H01L33/60 主分类号 H01L33/48
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