CHIP-TYPE SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

摘要

This invention provides a chip-type solid electrolytic capacitor in which a cathode conductive layer (19) is formed on that surface of a cathode layer (15) of a capacitor element (16) which is located opposite to the surface where an anode lead wire (14) is led out, and on a part of a peripheral surface of the cathode layer adjacent to this surface, so that even if the capacitor element is obliquely inserted in a mold for molding a resin shell (20), the cathode conductive layer (19) will be brought into contact with an inner wall of the mold to modify the inclination of the capacitor element, with the result that when sandblast treatment is performed to roughen the cathode-side peripheral surface of the resin shell, there will not be caused a visual demerit of the cathode layer (19) being exposed from the resin shell (20).