SI WAFER MIRROR LIKE SURFACE MACHINING METHOD AND MACHINING DEVICE

摘要

PURPOSE:To eliminate the dispersion of roughness generated being influenced by the specification of polishing cloth in a mirror like surface machining device for Si wafers. CONSTITUTION:A mirror like surface table 1 is closed in a chamber 7, and pressure is applied to a machining solution 3 to apply pressure to abrasive grain. In this state, the table 1 is rotated to perform polishing. Constantly uniform pressure thereby acts upon the abrasive grain so as to obtain desirable roughness.