| 摘要 |
<p>PURPOSE:To eliminate efficiently the air, which intrudes and remains in an adhesion layer between a plate to be adhered and, a wafer, as well as to provide a method of obtaining the stable adhesion layer. CONSTITUTION:A wafer bonding device for bonding a wafer to a plate has a pressing cylinder 6, an elastic member 1, whose wafer pressing part is formed into a conical projected shape, a clearance 7 for absorbing the deformation in the longitudinal direction of the elastic member 1 and press members 8 for preventing the deformation in the lateral direction of the member 1 and the wafer is made to bond to the plate by bringing into contact the elastic member to the wafer by pressure, whereby it is achieved to bond the wafer to the plate. Thereby, the air, which intrudes and remains in an adhesion layer between the plate to be adhered and the wafer, can be efficiently eliminated and moreover, a sufficient pressing force is applied also to the outer peripheral part of the wafer and the generation of a pressing unevenness at the outer peripheral part of the wafer can be prevented.</p> |
