| 摘要 |
PURPOSE:To allow easy handling, the elimination of the time required for optical axis alignment, etc., easy mass production, and packaging to a higher density. CONSTITUTION:A lower substrate 1a of the optical printed circuit board, a high-polymer film written with optical waveguides and an upper cap 1b of the optical printed circuit board are disposed to face each other by aligning the central axes. This axis alignment is executed in such a manner that the centers of the optical waveguides in the high-polymer film align to the centers of projections 9. The upper cap 1b is then pressed, by which the high-polymer film is struck against the sharp parts 9b of the projections 9 provided on the lower substrate 1a and is teared. The front ends of the projections and the end faces 2b of the waveguides are polished to smooth the front surface of the substrate. |
