| 摘要 |
PURPOSE:To provide manufacture of printed wiring board, in which the properties of the gold plated layer of a printed wiring board with the gold-plated copper pattern layer are not changed. CONSTITUTION:In the manufacture of a printed wiring board, in which resist films having a specified pattern are formed onto the copper layers 7 of the printed wiring board 4, a surface of which has the copper layers 7 and which is laminated in multilayers, metallic layers 13 are formed onto the wiring board while using the resist films as masks, and the copper layers except the copper layers of the lower sections of the metallic layers 13 are removed through etching in a specified pattern employing the metallic layers 13 as masks, the copper layers 7 are etched in the specified pattern, the printed wiring board 4 is dipped in a treatment liquid, and a process, in which the side faces of the copper layers 7 formed through etching in the predetermined pattern are oxidized, is given. |
