PACKAGE FOR MOUNTING ELECTRONIC CIRCUIT PART,申请号JP19910216604-传众专利搜索

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发明名称	PACKAGE FOR MOUNTING ELECTRONIC CIRCUIT PART
摘要
申请公布号	JPH0541569(A)	申请公布日期	1993.02.19
申请号	JP19910216604	申请日期	1991.08.02
申请人	KOKUSAI ELECTRIC CO LTD	发明人	NAGANO TAKAHIRO
分类号	H05K1/14;H05K5/00;H05K5/06	主分类号	H05K1/14
代理机构		代理人
主权项
地址

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