VIA HOLE STRUCTURE AND FORMATION THEREOF

摘要

PURPOSE:To provide a via hole structure and formation thereof for interconnection of layers formed within an insulating layer by forming a via hole formed on an insulating film such as a multilayer wiring substrate in such a shape that the via hole is filled perfectly within a metal film when the metal film for wiring is formed on the insulating film. CONSTITUTION:A diameter of a via hole 7 formed on a insulating layer 8 made of a plurality of layers of resin insulator film or photosensitive resin insulator film 2.5 of a multilayer wiring board alternately laminating an insulating layer 8 consisting of a plurality of layers of resin insulator film or photosensitive resin insulator film 2.5 and a wiring layer 13 consisting of conductors is gradually enlarged toward the upper part from the bottom part.