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发明名称
MOLDING DIE
摘要
申请公布号
JPH0531767(A)
申请公布日期
1993.02.09
申请号
JP19910214764
申请日期
1991.07.30
申请人
OMRON CORP
发明人
HINOTA SEISUKE;TAKENAKA YUTAKA;HASHIZUME SHINICHI
分类号
B29C33/38;B29C45/26;B29C45/27
主分类号
B29C33/38
代理机构
代理人
主权项
地址
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