| 摘要 |
PURPOSE:To enable reliability of mounting to be improved in a method for mounting surface-mounted parts with leads. CONSTITUTION:A title item is constituted by a process 20 for allowing a liquid flux to adhere to all leads of surface-mounted parts, a process 21 for allowing a solder powder to adhere to a liquid flux which adhere to the lead, and a process 24 for soldering to a foot print on a printed circuit board by melting the solder powder adhering. |
