发明名称 LEAD FRAME
摘要 PURPOSE:To provide a lead frame which can cope with the pitch narrowing of a lead part by dispensing with the removal of a tie bar by punching. CONSTITUTION:Filling 5 consisting of electric insulating material is applied along the mold line A of a lead part 3. The filling 45 serves to keep the lead parts 3 in place and prevent flashes of resin in molding.
申请公布号 JPH04369259(A) 申请公布日期 1992.12.22
申请号 JP19910145823 申请日期 1991.06.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAMI SEIJI
分类号 H01L21/56;H01L23/28;H01L23/50 主分类号 H01L21/56
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