| 摘要 |
<p>PURPOSE:To enhance a humid-proof characteristic of a package by a method wherein the surface of the package composed of resins is coated with a humid- proof resin film. CONSTITUTION:The surface of a package 7 composed of resins is coated with a humid-proof characteristic resin film 8. That is, a semiconductor is mounted on a semiconductor device mount tray within a chamber for coating to supply gaseous humid-proof resins to a coating chamber, whereby the surface of the package 7 composed of the resins is coated with the humid-proof characteristic resin film 8. Thus, a humid-proof characteristic of the package 7 rises, and a time capable of mounting the semiconductor device under a normal temperature and a normal humidity can be prolonged while the package is unpacked and mounted. Moreover, reliability for a long interval after mounted is enhanced.</p> |
