| 摘要 |
PURPOSE:To facilitate checking a printed wiring substrate and adjustment by connecting a check-terminal part to an electrode land formed on the portion of the substrate corresponding to one side of the part through a process of soldering, and then fixing the part to the land in such an inclined condition that the end-portion of the part on the opposite side of the soldered portion may be floated from the surface of the substrate. CONSTITUTION:Only one electrode-land 4 to a check-terminal part 1 is formed on a printed-wiring-substrate body 2 at its position corresponding to one side of the part 1, and then the part 1 is mounted in a position indicated by a mark of 1a. Thereafter, the part 1 is soldered by a reflow soldering device, and it is drawn toward the side of the land 4 by the surface tension of solder 3, so that it may be retained and fixed in its inclined condition. Another signal-pattern can thus be arranged on the lower portion of the part 1 so as to provide a high-density printed wiring substrate, and because the part 1 is floated from the surface of the substrate a test probe-pin can be fixed without difficulty so as to facilitate checking the substrate and adjusting its checking condition. |
