| 摘要 |
PURPOSE:To enhance an efficiency of supplying gas in a load locking chamber. CONSTITUTION:In a heat treating apparatus having a process tube 4 for heat treating a water 2 to be heat treated, and a load locking chamber 8 coupled to the tube to contain a material to be heat treated and to be held in vacuum or in an arbitrary gas atmosphere, a nozzle 42 body in which a plurality of gas injection ports 46 are formed in space to inject uniform gas to the material to be heat treated on a wafer boat 18, is mounted to introduce gas to the locking chamber.
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