| 摘要 |
PURPOSE:To provide a resin molding device having no such fear that in the case where the primary product is molded by a high-pressure IMC method by setting up SNC into two product molding of a bottom force by splitting the SMC and giving pressure, a porosity may be generated in a meeting part off the SMC, an injected IMC material may be filled into the porosity after molding of the primary molded product and forming of a uniform IMC layer may become difficult. CONSTITUTION:A vacuum suction hole 11 is provided in a bottom force 5 of a part where SMC 30 is to meet, pressure sensors 12, 12 are provided in the vicinity of the vacuum suction hole 11 and air is sucked through the vacuum suction hole 11 unite the SMC 30 is detected by the pressure sensors 12, 12 or the air is held within a groove 40 by providing the groove 40 in the bottom force 5 the meeting part of the SMC 30. A number of porosities to be formed in the meeting part of the SMC is reduced drastically and then an IMC material is injected. |
