| 摘要 |
PURPOSE:To solder with low void by soldering with undermentioned method, melting the solder from the center of the material to be soldered to the out side and pushing out the air hole (void) generated at the time for melting the solder. CONSTITUTION:By using a ceramics circuit board 1, a laminated sheet solder 2, a heat radiating block 3, a heat conductive jig 4, a hot plate 5, a loading jig 6, the heat radiating block 3 is soldered the ceramics circuit board 1 with the laminated sheet solder 2 of differential width. |
